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Molex Electronics Ltd.
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Part No. |
44432-1202 0444321202
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Description |
3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 3.00mm (.118") Pitch Micro-Fit 3.0 BMI垄芒 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 12 Circuits, 0.38楼矛m (15楼矛") Gold (Au) S
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File Size |
224.13K /
5 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
93944-432HLF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 32 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
44432-1201 0444321201
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Description |
3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 12 Circuits, Tin (Sn) Plating 3.00mm (.118") Pitch Micro-Fit 3.0 BMI垄芒 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 12 Circuits, Tin (Sn) Plating
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File Size |
224.08K /
5 Page |
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it Online |
Download Datasheet |
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NXP Semiconductors N.V.
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Part No. |
PCF85103C-2P/0011
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Description |
256 x 8-bit CMOS EEPROM with I2C-bus interface; Package: SOT97-1 (DIP8); Container: Tube 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8
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File Size |
140.22K /
20 Page |
View
it Online |
Download Datasheet |
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Bom2Buy.com
Price and Availability
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