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GLZ33D B65939 38000 2SK40 01900 2SD14 2SB1562 HZK18
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    Hammond Manufacturing Ltd.
Part No. HME1868
OCR Text ...view door removed 516mm 20.33in opening 1706mm 67.18in opening 625mm 24.62in opening 1701mm 66.97in opening inner panel 1696mm 66.77in 499mm 19.65in 506mm 19.94in gland plate cutout 312mm 12.27in gland plate cutout 1895mm 74.61in
Description PAINTED TEXTURED GRAY RAL 7035

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    Everlight
Part No. 15-23B-R6G6BHC-A01-2T
OCR Text ...are ready to use. 2.2 before opening the package, the leds should be kept at 30 or less and 90%rh or less. 2.3 the leds should be used within a year. 2.4 after opening the package, the leds should be kept at 30 or less and 70...
Description Full Color Chip LEDs

File Size 306.78K  /  12 Page

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    Everlight
Part No. 11-21UYC-S530-XX-TR8
OCR Text ...are ready to use. 2.2 before opening the package, the leds should be kept at 30 or less and 90%rh or less. 2.3 the leds should be used within a year. 2.4 after opening the package, the leds should be kept at 30 or less and 60...
Description 11-21UYC/S530-XX/TR8 1206 Package Chip LEDs

File Size 189.63K  /  9 Page

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    TJ150F06M3L

Toshiba Semiconductor
Part No. TJ150F06M3L
OCR Text ...d ripping of the bag. (3) after opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5 to 30 and rh70% or below. perform reflow at most twice. (4) the moisture-proof bag may be stored uno...
Description MOSFETs

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    TJ150F04M3L

Toshiba Semiconductor
Part No. TJ150F04M3L
OCR Text ...d ripping of the bag. (3) after opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5 to 30 and rh70% or below. perform reflow at most twice. (4) the moisture-proof bag may be stored uno...
Description MOSFETs

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    TJ100F06M3L

Toshiba Semiconductor
Part No. TJ100F06M3L
OCR Text ...d ripping of the bag. (3) after opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5 to 30 and rh70% or below. perform reflow at most twice. (4) the moisture-proof bag may be stored uno...
Description MOSFETs

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    TMP93CF77F TMP95CS54F TMP96C141BF TMP91C016F TMP91C025F TMP91C219F TMP91C815F TMP91C824F TMP91C829F TMP91CU10F TMP91CW11

TOSHIBA[Toshiba Semiconductor]
Part No. TMP93CF77F TMP95CS54F TMP96C141BF TMP91C016F TMP91C025F TMP91C219F TMP91C815F TMP91C824F TMP91C829F TMP91CU10F TMP91CW11F TMP91CW12AF TMP91CW12F TMP91CW18AF TMP91CY22F TMP91PW10F TMP91PW11F TMP91PW12F TMP91PW18AF TMP95C061BF TMP94C251AF TMP95CS64F TMP95CS66F TMP95CW64F TMP95CW65F TMP95PW64F TMP95C265F TMP95PS54F TMP93CM40F TMP93CT76F TMP93PS40DF TMP93PS40F TMP93PS42AF TMP93PS44F TMP93CU44DF TMP93C071F TMP96PM40F TMP96CM40F TMP96C031ZF TMP93CS32F TMP93CW40DF TMP93CW41DF TMP93CW44DF TMP93CW46AF TMP93CW76F TMP93CS20F TMP93CF76F TMP96C041BF TMP93CW40D TMP94C241CF TMP95C063F TMP93CS45F TMP93PW44ADF TMP95FW54AF TMP93PW20AF TMP93PW40DF TMP93PW46AF TMP95C001F TMP95CU54AF TMP95CW54AF TMP95FY64F TMP93PW32F TMP91FY22F TMP93PW76F TMP91FY12AF TMP93CS40DF TMP93CS40F TMP93CS41DF TMP93CS41F TMP93CS42AF TMP93CS44F TMP93CU76F TMP94FU81F
OCR Text ...ng methods and conditions after opening the pack differ depending on products to be used. See Table 2.2 and 2.3 for the details. For locally heating a lead part, soldering iron method is recommended. For other localized heating methods, ref...
Description Quality And Reliability Assurance / Handling Precautions

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    GX9533 GX9533-CQY GX9533-CTY

Electronic Theatre Controls, Inc.
ETC
GENNUM[Gennum Corporation]
Part No. GX9533 GX9533-CQY GX9533-CTY
OCR Text ...SYMBOL CONDITION For 90% eye opening 143 to 622 Mb/s, all hostile crosstalk MIN - TYP 850 80 MAX - UNITS Mb/s ps p-p - 70 - ps p-p tDLY Average of all channels - 1.7 - ns - 1.1 - ns ...
Description Serial Digital 8x9 Crosspoint

File Size 96.90K  /  8 Page

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    TJ100F04M3L

Toshiba Semiconductor
Part No. TJ100F04M3L
OCR Text ...d ripping of the bag. (3) after opening the moisture-proof bag, the devices should be assembled within two weeks in an environment of 5 to 30 and rh70% or below. perform reflow at most twice. (4) the moisture-proof bag may be stored uno...
Description MOSFETs

File Size 279.69K  /  10 Page

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    Hammond Manufacturing Ltd.
Part No. HME1465
OCR Text ...view door removed 516mm 20.33in opening 1306mm 51.43in opening 325mm 12.81in opening 1301mm 51.22in opening inner panel 1296mm 51.02in 499mm 19.65in 206mm 8.13in gland plate cutout 312mm 12.27in gland plate cutout 1495mm 58.87in
Description PAINTED TEXTURED GRAY RAL 7035

File Size 100.35K  /  1 Page

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IFS-OPEN-END-DATACABLE
Phoenix Contact Data cable with open cable ends for communication - e.g. - between a Phoenix Contact Inline communication terminal (IB IL RS UNI-PAC - 2700893) and Phoenix Contact devices with the 12-pos. IFS data port - such as QUINT UPS-IQ or TRIO UPS 100: USD107.7
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Bristol Electronics

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OPENING TOOLS (6 PCS OF 1 SET)
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