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  AB-33G1-6V-B Datasheet PDF File

For AB-33G1-6V-B Found Datasheets File :: 37+       Page :: | 1 | 2 | 3 | <4> |   

    MAXIM - Dallas Semiconductor
Part No. MAX1818EUT33G16 MAX1818EUT33TG16 MAX1818EUT33-T MAX1818EUT50TG16 MAX1818EUT15-TG077 MAX1818EUT18-TG05
Description 500mA, Low-Dropout Linear Regulator in SOT23

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Amphenol Communications Solutions

Part No. RJE5918833G1
Description Modular Jack - 8P8C, RA, Cat6, THT, Standard Profile, Single Port, Shield With Top EMI Tabs Only, With LEDs
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Diodes, Inc.
Part No. 12065G473Z-MR 06033G104Z-MR 0805YG105Z-MR 1206YG225Z-MR 1210YG106Z-MR 12065G224Z-MR 12065G105Z-MR 08053G474Z-MR 06035G103Z-MR 12065G104Z-MR
Description CAP. 47NF MINIREEL 500PCS
CAP. 0.1UF MINIREEL 500PCS
CAP. 1UF MINIREEL 500PCS
CAP. 2.2UF MINIREEL 500PCS
CAP. 10UF MINIREEL 500PCS
CAP. 220NF MINIREEL 500PCS
CAP. 1000NF MINIREEL 500PCS
第470NF MINIREEL 500
CAP. 10NF MINIREEL 500PCS 第10NF MINIREEL 500
CAP. 100NF MINIREEL 500PCS

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Amphenol Communications Solutions

Part No. RJE5818833G1
Description Modular Jack - 8P8C, RA, Cat5e, THT, Standard Profile, Single Port, Shield With Top EMI Tabs Only, With LEDs
Tech specs    

Official Product Page

    1324G1 1332B0 1343B1 1334A1 1324A1 1327M1 1351B0 1351B2 1323G1 1326M0 1326G1 1326A1 1326B2 1326B0 1340M1 1330M1 1341B2 1

YEONHO Electronics Co., Ltd.
Cypress Semiconductor, Corp.
Data Delay Devices, Inc.
Vectron International, Inc.
APEM SA
Molex, Inc.
Anderson Power Products, Inc.
Part No. 1324G1 1332B0 1343B1 1334A1 1324A1 1327M1 1351B0 1351B2 1323G1 1326M0 1326G1 1326A1 1326B2 1326B0 1340M1 1330M1 1341B2 1330G2 1331B0 1331B2 1334G1 1335M0 1331G1 1339A0 1343A2 1337M1 1335M2 1339B1 1330G0 1353A2 1338B1 1339A2 1335G1 1330A2 1327A2 1327A0 1322A1 1333G1 1339M1 1343B2 1345M1 1347B1 1342B0 1342B2 1342G1 1348B1 1322B0 1321B2 1340G2 1332A1 1334M0 1332B2 1324B2 1340B1 1334B0 1340A2 1334M2 1331A1 1332M0 1324M0 1340A0 1340G0 1324B0 1331M0 1332G1 1322M0 1322M2 1329B2 1325B0 1321G1 1328G1 1330A0 1337A2 1337B1 1337G2 1337A0 1322G1 1337G0 1325A1 1328B0 1359M1 1338A2 1323B0 1333B0 1333M0 1356M1 1352B0 1356G2 1354G2 1349A2 1341B0 1341A2 1346M1 1327G2 1336B2
Description Peripheral IC 外围芯片

File Size 783.42K  /  6 Page

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Amphenol Communications Solutions

Part No. RJE6018833G1
Description Modular Jack - 8P8C, RA, Cat6A, THT, Standard Profile, Single Port, Shield With Top EMI Tabs Only, With LEDs
Tech specs    

Official Product Page

    1254G0 1254G1 1254G2 1256B1 1224G1 1232B2 1232B0 1242G2 1224A1 1234A1 1251B1 1225A1 1230A1 1240M1 1254B1 1231A1 1235M2 1

Microtips Technology, Inc.
NEC, Corp.
Continental Device India, Ltd.
KEMET Corporation
Rubycon, Corp.
Lattice Semiconductor, Corp.
Paladin Tools
Alpha Wire Company
CONEC GmbH
TUSONIX, Inc.
Illinois Capacitor, Inc.
Ironwood Electronics
DB Lectro, Inc.
Kyocera, Corp.
Part No. 1254G0 1254G1 1254G2 1256B1 1224G1 1232B2 1232B0 1242G2 1224A1 1234A1 1251B1 1225A1 1230A1 1240M1 1254B1 1231A1 1235M2 1231B2 1230G1 1234G1 1235M0 1233G1 1239A1 1237M0 1253A2 1238B2 1239B0 1231G1 1238B0 1235G1 1231B0 1237M2 1239B2 1243A2 1239M0 1239M2 1247B1 1243B1 1248B1 1242B1 1242G0 1245M1 1242A0 1255B1 1221B2 1221A1 1246G2 1252B1 1252A2 1252G2 1234B0 1237G1 1237B0 1252A0 1246A2 1224B0 1221G1 1221B0 1224B2 1252G0 1246A0 1246G0 1246M1 1237B2 1254A0 1224M0 1246B1 1234M2 1254M1 1237A1 1225B0 1234B2 1221M0 1252M1 1254A2 1222M1 1234M0 1227A1 1226B0 1226B2 1229B2 1226G1 1225B2 1228G1 1253M1 1222G2 1230M0 1230M2 1222G0 1232G1 1247G0 1247G2 1259M1 1223B0 1249G0 1227B0 1222A2 1243A0 1248A0 1226M0 1232M2 1244G2 1223M0 1247M1
Description Peripheral IC 外围芯片
PeripheralIC

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Amphenol Communications Solutions

Part No. RJE4818833G1
Description Modular Jack - 8P8C, Right Angle, Cat5e, THT, Low Profile, Single Port, Shield With Top EMI Tabs Only, With LEDs
Tech specs    

Official Product Page

    Renesas Electronics Corporation.
Renesas Electronics, Corp.
Part No. M38230G4-XXXFP M38230G4-XXXHP M38231G4-XXXHP M38232G4-XXXFP M38232G4-XXXHP M38233G4-XXXFP M38233G4-XXXHP M38234G4-XXXFP M38234G4-XXXHP M38235G4-XXXFP M38230G6-XXXFP M38230G6-XXXHP M38231G6-XXXFP M38231G6-XXXHP M38232G6-XXXFP M38232G6-XXXHP M38233G6-XXXFP M38233G6-XXXHP M38234G6-XXXFP M38234G6-XXXHP M38235G6-XXXFP M38235G6-XXXHP M38236G6-XXXHP M38237G6-XXXFP M38237G6-XXXHP M38238G6-XXXFP M38230G7-XXXFP M38230G7-XXXHP M38231G7-XXXFP M38231G7-XXXHP M38232G7-XXXFP M38232G7-XXXHP M38233G7-XXXFP M38233G7-XXXHP M38234G7-XXXFP M38234G7-XXXHP M38235G7-XXXFP M38235G7-XXXHP M38236G7-XXXFP M38236G7-XXXHP M38237G7-XXXFP M38237G7-XXXHP M38238G7-XXXFP M38238G7-XXXHP M38239G7-XXXFP M38239G7-XXXHP M38230G8-XXXFP M38230G8-XXXHP M38231G8-XXXFP M38231G8-XXXHP M38232G8-XXXFP M38232G8-XXXHP M38233G8-XXXFP M38233G8-XXXHP M38234G8-XXXFP M38234G8-XXXHP M38235G8-XXXFP M38235G8-XXXHP M38236G8-XXXFP M38236G8-XXXHP M38237G8-XXXFP M38237G8-XXXHP M38238G8-XXXFP M38238G8-XXXHP M38230GA-XXXFP M38230GA-XXXHP M38231GA-XXXFP M38231GA-XXXHP M38232GA-XXXFP M38232GA-XXXHP M38233GA-XXXFP M38233GA-XXXHP M38234GA-XXXFP M38234GA-XXXHP M38235GA-XXXFP M38235GA-XXXHP M38236GA-XXXFP M38236GA-XXXHP M38237GA-XXXFP M38237GA-XXXHP
Description 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 512Kb x 36; Vcc (V): 3.1 to 3.6 V
36-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 3.1 to 3.6 V
18-Mbit (512K x 36/1M x 18) Pipelined SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2 M x 18/512K x 72) Flow-Through SRAM with NoBL(TM) Architecture; Architecture: NoBL, Flow-through; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 1Mb x 72; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 512Kb x 72; Vcc (V): 3.1 to 3.6 V
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
Sync SRAM; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 1Mb x 72; Vcc (V): 3.1 to 3.6 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture (2.5 Cycle Read Latency); Architecture: QDR-II , 4 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit DDR-II SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency); Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V 单芯位CMOS微机
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V 单芯位CMOS微机
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER 单芯位CMOS微机
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 2.4 to 2.6 V 单芯位CMOS微机
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V 单芯位CMOS微机
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
36-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER 单芯8位CMOS微机
Sync SRAM; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V

File Size 901.80K  /  76 Page

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    M3823AGF-XXXHP 3823 M38230G1-XXXFP M38230G1-XXXHP M38230G2-XXXFP M38230G2-XXXHP M38230G3-XXXFP M38230G3-XXXHP M38230G4-X

RENESAS[Renesas Electronics Corporation]
Part No. M3823AGF-XXXHP 3823 M38230G1-XXXFP M38230G1-XXXHP M38230G2-XXXFP M38230G2-XXXHP M38230G3-XXXFP M38230G3-XXXHP M38230G4-XXXFP M38230G4-XXXHP M38230G5-XXXFP M38230G5-XXXHP M38230G6-XXXFP M38230G6-XXXHP M38230G7-XXXFP M38230G7-XXXHP M38230G8-XXXFP M38230G8-XXXHP M38230G9-XXXFP M38230G9-XXXHP M38230GA-XXXFP M38230GA-XXXHP M38230GB-XXXFP M38230GB-XXXHP M38230GC-XXXFP M38230GC-XXXHP M38230GD-XXXFP M38230GD-XXXHP M38230GE-XXXFP M38230GE-XXXHP M38230GF-XXXFP M38230GF-XXXHP M38231G1-XXXFP M38231G1-XXXHP M38231G2-XXXFP M38231G2-XXXHP M38231G3-XXXFP M38231G3-XXXHP M38231G4-XXXFP M38231G4-XXXHP M38231G5-XXXFP M38231G5-XXXHP M38231G6-XXXFP M38231G6-XXXHP M38231G7-XXXFP M38231G7-XXXHP M38231G8-XXXFP M38231G8-XXXHP M38231G9-XXXFP M38231G9-XXXHP M38231GA-XXXFP M38231GA-XXXHP M38231GB-XXXFP M38231GB-XXXHP M38231GC-XXXFP M38231GC-XXXHP M38231GD-XXXFP M38231GD-XXXHP M38231GE-XXXFP M38231GE-XXXHP M38231GF-XXXFP M38231GF-XXXHP M38232G1-XXXFP M38232G1-XXXHP M38232G2-XXXFP M38232G2-XXXHP M38232G3-XXXFP M38232G3-XXXHP M38232G4-XXXFP M38232G4-XXXHP M38232G5-XXXFP M38232G5-XXXHP M38232G6-XXXFP M38232G6-XXXHP M38232G7-XXXFP M38232G7-XXXHP M38232G8-XXXFP M38232G8-XXXHP M38232G9-XXXFP M38232G9-XXXHP M38232GA-X
Description SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER

File Size 877.42K  /  76 Page

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    CS20604MX333G104KE CS20604MX333G104ME CS20604MX333G330KE CS20604MX333G330ME CS20604MX333G392KE CS20604MX333G392ME CS2060

Vishay Siliconix
Part No. CS20604MX333G104KE CS20604MX333G104ME CS20604MX333G330KE CS20604MX333G330ME CS20604MX333G392KE CS20604MX333G392ME CS20604MX333G471KE CS20604MX333G471ME CS20604MX333J104KE CS20604MX333J104ME CS20604MX333J330KE CS20604MX333J330ME CS20604MX333J392KE CS20604MX333J392ME CS20604MX333J471KE CS20604MX333J471ME CS20604MX333S104KE CS20604MX333S330KE CS20604MX333S330ME CS20604MX333S392KE CS20604MX333S392ME CS20604MX333S471KE CS20604MX333S471ME CS20604MC333G104KE CS20608MC333G104KE CS20618MC333G104KE CS20604MC333G104ME CS20608MC333G104ME CS20618MC333G104ME CS20604MC333G330KE CS20608MC333G330KE CS20618MC333G330KE CS20604MC333G330ME CS20608MC333G330ME CS20618MC333G330ME CS20604MC333G392KE CS20608MC333G392KE CS20618MC333G392KE CS20604MC333G392ME CS20608MC333G392ME CS20618MC333G392ME CS20604MC333G471KE CS20608MC333G471KE CS20618MC333G471KE CS20604MC333G471ME CS20608MC333G471ME CS20618MC333G471ME CS20604MC333J104KE CS20608MC333J104KE CS20618MC333J104KE CS20604MC333J104ME CS20608MC333J104ME CS20618MC333J104ME CS20604EX333G104KE CS20608EX333G104KE CS20604TX100G104KE CS20608TX100G104KE CS20618TX100G104KE CS20604TX100G104ME CS20608TX100G104ME CS20618TX100G104ME CS20604TX100G330KE CS20608TX100G330KE CS2
Description    Resistor/Capacitor Networks ECL Terminators and Line Terminator, Conformal Coated, SIP

File Size 291.94K  /  3 Page

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