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  dip-22 Datasheet PDF File

For dip-22 Found Datasheets File :: 18300    Search Time::2.156ms    
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    829-22-011-20-002101

Mill-Max Mfg. Corp.
Part No. 829-22-011-20-002101
OCR Text ...vrms min. for series 117 shrink dip) note: materials above 446f (230c) are considered suitable for "eutectic" reflow soldering, above 500f (260c) for "lead-free" reflow soldering. certificate?of?compliance: this is to certify that the prod...
Description Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole

File Size 102.24K  /  2 Page

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    829-22-008-20-002101

Mill-Max Mfg. Corp.
Part No. 829-22-008-20-002101
OCR Text ...vrms min. for series 117 shrink dip) note: materials above 446f (230c) are considered suitable for "eutectic" reflow soldering, above 500f (260c) for "lead-free" reflow soldering. certificate?of?compliance: this is to certify that the prod...
Description Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole

File Size 101.95K  /  2 Page

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    829-22-010-20-002101

Mill-Max Mfg. Corp.
Part No. 829-22-010-20-002101
OCR Text ...vrms min. for series 117 shrink dip) note: materials above 446f (230c) are considered suitable for "eutectic" reflow soldering, above 500f (260c) for "lead-free" reflow soldering. certificate?of?compliance: this is to certify that the prod...
Description Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole

File Size 102.15K  /  2 Page

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    LBD101-22-XX-PF

LIGITEK electronics co., ltd.
Part No. LBD101-22-XX-PF
OCR Text ...t 260C 2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2C/sec(max) Ramp-Down:-5 C/sec(max) Sol...22-XX-PF Page 8/8 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If...
Description BAR DIGIT LED DISPLAY

File Size 127.56K  /  9 Page

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    829-22-013-20-002101

Mill-Max Mfg. Corp.
Part No. 829-22-013-20-002101
OCR Text ...vrms min. for series 117 shrink dip) note: materials above 446f (230c) are considered suitable for "eutectic" reflow soldering, above 500f (260c) for "lead-free" reflow soldering. certificate?of?compliance: this is to certify that the prod...
Description Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole

File Size 102.40K  /  2 Page

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    829-22-020-20-002101

Mill-Max Mfg. Corp.
Part No. 829-22-020-20-002101
OCR Text ...vrms min. for series 117 shrink dip) note: materials above 446f (230c) are considered suitable for "eutectic" reflow soldering, above 500f (260c) for "lead-free" reflow soldering. certificate?of?compliance: this is to certify that the prod...
Description Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole

File Size 102.24K  /  2 Page

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    829-22-001-20-002101

Mill-Max Mfg. Corp.
Part No. 829-22-001-20-002101
OCR Text ...vrms min. for series 117 shrink dip) note: materials above 446f (230c) are considered suitable for "eutectic" reflow soldering, above 500f (260c) for "lead-free" reflow soldering. certificate?of?compliance: this is to certify that the prod...
Description Interconnect Header

File Size 101.99K  /  2 Page

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    829-22-002-20-002101

Mill-Max Mfg. Corp.
Part No. 829-22-002-20-002101
OCR Text ...vrms min. for series 117 shrink dip) note: materials above 446f (230c) are considered suitable for "eutectic" reflow soldering, above 500f (...22/2013 page 1 of 2 rohs?compliance?statement?for?the?restriction?of?lead,?mercury,?cadmium?and?h...
Description Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole

File Size 101.73K  /  2 Page

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    829-22-004-20-002101

Mill-Max Mfg. Corp.
Part No. 829-22-004-20-002101
OCR Text ...vrms min. for series 117 shrink dip) note: materials above 446f (230c) are considered suitable for "eutectic" reflow soldering, above 500f (260c) for "lead-free" reflow soldering. certificate?of?compliance: this is to certify that the prod...
Description Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole

File Size 102.30K  /  2 Page

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    829-22-005-20-002101

Mill-Max Mfg. Corp.
Part No. 829-22-005-20-002101
OCR Text ...vrms min. for series 117 shrink dip) note: materials above 446f (230c) are considered suitable for "eutectic" reflow soldering, above 500f (260c) for "lead-free" reflow soldering. certificate?of?compliance: this is to certify that the prod...
Description Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole

File Size 102.36K  /  2 Page

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