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  agent Datasheet PDF File

For agent Found Datasheets File :: 2238    Search Time::1.157ms    
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    MMBZ5226B MMBZ5257B MMBZ5227B MMBZ5228B MMBZ5229B MMBZ5230B MMBZ5231B MMBZ5232B MMBZ5233B MMBZ5234B MMBZ5235B MMBZ5236B

FAIRCHILD[Fairchild Semiconductor]
Part No. MMBZ5226B MMBZ5257B MMBZ5227B MMBZ5228B MMBZ5229B MMBZ5230B MMBZ5231B MMBZ5232B MMBZ5233B MMBZ5234B MMBZ5235B MMBZ5236B MMBZ5237B MMBZ5238B MMBZ5239B MMBZ5240B MMBZ5241B MMBZ5242B MMBZ5243B MMBZ5244B MMBZ5245B MMBZ5246B MMBZ5247B MMBZ5248B MMBZ5249B MMBZ5250B MMBZ5251B MMBZ5252B MMBZ5253B MMBZ5254B MMBZ5255B MMBZ5256B
OCR Text ...ealant, and anti-static sprayed agent. These reeled pa in standard option are shipped with rts 3,000 units per 7" or 177cm diameter reel. The reels are dark blue in color an is made of polystyrene plastic (antid static coated). Other option...
Description Zeners

File Size 203.34K  /  6 Page

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    ST70137 ST70137TQFP

STMICROELECTRONICS[STMicroelectronics]
ST Microelectronics
Part No. ST70137 ST70137TQFP
OCR Text ...st This signal is sourced by an agent wishing to become a bus master. It is a point to point signal and each master has its own PCI_REQN. PCI_GNTN I I L PCI Grant The PCI_GNTN signal is a dedicated, point-to-point signal provided to each po...
Description UNICORNTM PCI & USB CONTROLLERLESS ADSL DMT TRANSCEIVER

File Size 139.22K  /  22 Page

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    INTEL82801 82801AB INTEL82B801 INTELB82801 82801AA

INTEL[Intel Corporation]
Part No. INTEL82801 82801AB INTEL82B801 INTELB82801 82801AA
OCR Text ...ICH0) or - 82801AA (ICH) PCI agent ISA Bridge (optional) ATA/66 for ICH ATA/33 for ICH0 4 IDE Drives 2xUSB GPIO LPC I/F Super I/O (required) Keyboard, Mouse, FD, PP, SP, IR FWH Note: 1. The 82801AB ICH0 is intended to be u...
Description 82801AB (ICH0) I/O Controller Hub

File Size 2,127.06K  /  414 Page

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    PCA1673 PCA1673U PCA1672 PCA1672U PCA1675 PCA1675U PCA1676 PCA1676U/10 PCA1677 PCA1677U

Philips Semiconductors
Part No. PCA1673 PCA1673U PCA1672 PCA1672U PCA1675 PCA1675U PCA1676 PCA1676U/10 PCA1677 PCA1677U
OCR Text ...der particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conducti...
Description 32 kHz watch circuits using a silver-oxide or a 3 V lithium battery

File Size 69.26K  /  12 Page

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    TZA3033 TZA3033T TZA3033U

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. TZA3033 TZA3033T TZA3033U
OCR Text ...der particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conducti...
Description SDH/SONET STM1/OC3 transimpedance amplifier

File Size 88.36K  /  16 Page

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    CGY2010G CGY2011G

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. CGY2010G CGY2011G
OCR Text ...der particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conducti...
Description GSM 4 W power amplifiers

File Size 73.43K  /  12 Page

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    CGY2013G CGY2013GC1

PHILIPS[Philips Semiconductors]
NXP Semiconductors
Part No. CGY2013G CGY2013GC1
OCR Text ...der particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conducti...
Description GSM 4 W power amplifier

File Size 86.11K  /  12 Page

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    CGY2014 CGY2014ATW

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. CGY2014 CGY2014ATW
OCR Text ...der particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or conve...
Description GSM/DCS/PCS power amplifier

File Size 68.39K  /  12 Page

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    CGY2021G

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. CGY2021G
OCR Text ...der particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conducti...
Description DCS/PCS 2 W power amplifier

File Size 72.33K  /  12 Page

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    CGY2030M

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. CGY2030M
OCR Text ...der particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conducti...
Description DECT 500 mW power amplifier

File Size 93.24K  /  12 Page

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