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19BC06MR 5932B CP150 FSB5045 AT24C 551001 CKG32KX HD64330
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    SHENZHEN FUMAN ELECTRON...
Part No. BISS0001A
OCR Text made ele ctronics group co., ltd. biss0001a ?? s&cic0806 ??? www.superchip.cn 1 ? 7 ? version 1.1 ? ? ? coms ??? ? ...
Description Infrared sensing signal processor

File Size 275.55K  /  7 Page

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    KINGBRIGHT[Kingbright Corporation]
Part No. DA56-11GWA DA56-11YWA DA56-11EWA DC56-11YWA DA56-11SRWA DC56-11EWA DC56-11GWA DC56-11SRWA
OCR Text ...cy Red source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Orange Light Emitting Diode. The Green source color devices are made with Gallium Phosphide Green Light Emitting Diode. The Yellow source color device...
Description 14.22mm (0.56INCH) DUAL DIGIT

File Size 149.31K  /  5 Page

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    L-115VEGW L-115VEYW L-115VGYW

Kingbright Corporation
Part No. L-115VEGW L-115VEYW L-115VGYW
OCR Text ...cy Red source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Orange Light Emitting Diode. The Green source color devices are made with Gallium Phosphide Green Light Emitting Diode. The Yellow source color device...
Description T-1(3mm) BI-COLOR INDICATOR LAMPS

File Size 123.13K  /  4 Page

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    Prosoft
Part No. MVI71-MCM
OCR Text ...he user. Every attempt has been made to assure that the information provided is accurate and a true reflection of the product's installation requirements. In order to assure a complete understanding of the operation of the product, the user...
Description PLC Platform / Modbus Communication Module

File Size 719.47K  /  103 Page

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    PBSS5160T

NXP Semiconductors
Philips Semiconductors
Part No. PBSS5160T
OCR Text ...NUMBER PBSS5160T Note 1. * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China. ORDERING INFORMATION TYPE NUMBER PBSS5160T PACKAGE NAME - DESCRIPTION plastic surface mounted package; 3 leads VERSION SOT23 MARKING CODE(1) U6*...
Description 60 V, 1 A PNP low VCEsat (BISS) transistor

File Size 100.52K  /  10 Page

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    G8HN G8HN-1A2T-H62-R G8HN-1A2T-R G8HN-1C2T-R

http://
OMRON[Omron Electronics LLC]
Part No. G8HN G8HN-1A2T-H62-R G8HN-1A2T-R G8HN-1C2T-R
OCR Text ...nt-friendly and light weight. * made in USA. Ordering Information Description Standard SPST type SPST type with unplated terminals Standard SPDT type G8HN-1A2T-R G8HN-1A2T-H62-R G8HN-1C2T-R Model Typical Applications * * * * * * * ...
Description Micro ISO Automotive Relay

File Size 134.24K  /  5 Page

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    HMC516

Hittite Microwave Corporation
Part No. HMC516
OCR Text ...dule. Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ba...
Description GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 7 - 17 GHz

File Size 289.37K  /  6 Page

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    HMC517

Hittite Microwave Corporation
Part No. HMC517
OCR Text ...dule. Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ba...
Description GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 17 - 26 GHz

File Size 286.67K  /  6 Page

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    HMC518

Hittite Microwave Corporation
Part No. HMC518
OCR Text ...dule. Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ba...
Description GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 20 - 32 GHz

File Size 291.06K  /  6 Page

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    HMC519

Hittite Microwave Corporation
Part No. HMC519
OCR Text ...dule. Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ba...
Description GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 18 - 32 GHz

File Size 306.71K  /  6 Page

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