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SGS Thomson Microelectronics
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| Part No. |
AN1012
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| OCR Text |
...nd 120 mAh, respectively. Their constituents have non-toxic and non-corrosive characteristics, and are chemically and thermally stable before, during, and after discharge. This makes these cells particularly attractive for use in electrical... |
| Description |
PREDICTING THE BATTERY LIFE AND DATA RETENTION PERIOD OF NVRAMS
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| File Size |
178.54K /
28 Page |
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SGS Thomson Microelectronics
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| Part No. |
AN1011
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| OCR Text |
...lls also need to be composed of constituents that are nontoxic, non-corrosive, and non-explosive. They also must be chemically and thermally stable before, during and after discharge. STMicroelectronics utilizes the 49 mAh BR1225X cell, and... |
| Description |
BATTERY TECHNOLOGY USED IN NVRAM PRODUCTS FROM ST
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| File Size |
31.56K /
4 Page |
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STATSCHIP[STATS ChipPAC, Ltd.]
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| Part No. |
FLGA
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| OCR Text |
...asitics per unit length for the constituents of the signal path. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire. Conductor Component Wire Net (2L) Total (2L) Wire Net (4L) Total (4L)
Note: Net = Total Trace L... |
| Description |
Fine Pitch Land Grid Array
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| File Size |
511.62K /
2 Page |
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STATSCHIP[STATS ChipPAC, Ltd.]
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| Part No. |
FLGA-SD
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| OCR Text |
...asitics per unit length for the constituents of the signal path. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire. Conductor Component Wire Net (2L) Total (2L) Wire Net (4L) Total (4L)
Note: Net = Total Trace L... |
| Description |
Fine Pitch Land Grid Array - Stacked Die
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| File Size |
533.77K /
2 Page |
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STATSCHIP[STATS ChipPAC, Ltd.]
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| Part No. |
FBGA-SD
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| OCR Text |
...asitics per unit length for the constituents of the signal path. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire. Conductor Component Wire Net (2L) Total (2L) Wire Net (4L) Total (4L) Length (mm) 2 2-7 4-9 2 2-... |
| Description |
Fine Pitch Ball Grid Array - Stacked Die
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| File Size |
555.83K /
2 Page |
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STATSCHIP[STATS ChipPAC, Ltd.]
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| Part No. |
LFBGA-H FBGA
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| OCR Text |
...asitics per unit length for the constituents of the signal path. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire. Conductor Component Wire Net (2L) Total (2L) Wire Net (4L) Total (4L) Length (mm) 2 2-7 4-9 2 2-... |
| Description |
Fine Pitch Ball Grid Array
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| File Size |
555.50K /
2 Page |
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Atmel
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| Part No. |
TSS902E
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| OCR Text |
...02E device architecture and its constituents functionality.
DUP[7:0] AD[7:0] AS CS RDWRB
RESETB TESTxxx MICROCONTROLLER INTERFACE & TEST IRQ
REED SOLOMON DEC.
VITERBI DECODER
DEINTERLEAVER
DEPUNCTURING
DESCRAMBLER
IEXT... |
| Description |
Viterbi and Reed–Solomon FEC Decoder
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| File Size |
331.26K /
45 Page |
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it Online |
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