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RFMD[RF Micro Devices]
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| Part No. |
RF2162_06 RF2162 RF2162PCBA
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| OCR Text |
...und should be isolated from the backside ground contact on top metal layer. Ground for stage 1. Keep traces physically short and connect immediately to ground plane for best performance. This ground should be isolated from the backside grou... |
| Description |
3V 900MHz LINEAR AMPLIFIER
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| File Size |
240.65K /
10 Page |
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RFMD[RF Micro Devices]
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| Part No. |
RF2163_06 RF2163 RF2163PCBA RF216306
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| OCR Text |
...in leadless chip carrier with a backside ground and is self-contained with the exception of the output matching network and power supply feed line.
0.10 C B
-B-
3V, 2.5GHz LINEAR POWER AMPLIFIER
RoHS Compliant & Pb-Free Product * Co... |
| Description |
3V, 2.5GHz LINEAR POWER AMPLIFIER
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| File Size |
144.75K /
10 Page |
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it Online |
Download Datasheet |
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RFMD[RF Micro Devices]
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| Part No. |
RF2175_06 RF2175 RF2175PCBA RF217506
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| OCR Text |
...is a small SSOP-16 plastic with backside ground.
-A0.154 0.012 0.008 0.004 0.002 Note 3
EXPOSED HEATSINK
Exposed Heat Sink
0.196 0.189
0.025
0.123 0.107
0.237
0.063 0.057
0.087 0.071
8 MAX 0 MIN
NOTES: 1. Shad... |
| Description |
3V 400MHz LINEAR AMPLIFIER
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| File Size |
125.32K /
6 Page |
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it Online |
Download Datasheet |
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RFMD[RF Micro Devices]
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| Part No. |
RF2352PCBA RF2352
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| OCR Text |
...nd connection for die flag. The backside of the package should be soldered to a top side ground pad which is connected to the ground plane with multiple vias.
Rev A4 010720
4-179
RF2352
Application Schematic
VCC 1 nF
Prelimina... |
| Description |
3V CDMA DRIVER AMPLIFIER
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| File Size |
76.07K /
6 Page |
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it Online |
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SIRENZA[SIRENZA MICRODEVICES]
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| Part No. |
SFT-0100
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| OCR Text |
...t monitor Patented DCDR circuit backside vias eliminate the need for ground wirebonds
CDCDR *Patented
Cext
Applications
* * * * * *
Optical Receiver Modules XFP, XENPAK, XPAK, X2 modules 9.953 Gb/s SONET OC-192/SDH STM-64 10.... |
| Description |
Transimpedance Amplifier
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| File Size |
158.12K /
4 Page |
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it Online |
Download Datasheet |
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| Part No. |
MA4SPS42
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| OCR Text |
...destal an d connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. selective backside metallization is applied producing a surface mount device. this vertical topology provide... |
| Description |
MA4SPS42
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| File Size |
209.87K /
7 Page |
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it Online |
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SIRENZA[SIRENZA MICRODEVICES]
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| Part No. |
SGB-6533Z SGB-6533
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| OCR Text |
..., 6, 7,8,11, 12,14 3 5 10 13 16 backside Function NC RFIN GND RFOUT VBIAS VCC GND Description These are no connect pins. Leave them unconnected on the PC board. RF input pin. A DC voltage should not be connected externally to this pin An ex... |
| Description |
DC - 3 GHz Active Bias Gain Block
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| File Size |
135.42K /
6 Page |
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it Online |
Download Datasheet |
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