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For assembly- Found Datasheets File :: 43756    Search Time::1.313ms    
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    DS1112SG57 DS1112SG DS1112SG55 DS1112SG56 DS1112SG58 DS1112SG59 DS1112SG60

DYNEX[Dynex Semiconductor]
Part No. DS1112SG57 DS1112SG DS1112SG55 DS1112SG56 DS1112SG58 DS1112SG59 DS1112SG60
OCR Text ...exsemi.com DS1112SG POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping...
Description Rectifier Diode

File Size 94.33K  /  7 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGS2303-EEU
OCR Text ...Compatible with Fully Automated Assembly Series-Shunt-Shunt Configuration Chip Dimensions 2.16 x 1.65 x 0.1 mm * * Typical Wafer Probe Data 0 -5 -10 Return Loss (dB) -15 -20 -25 -30 -35 -40 2 4 6 8 10 12 14 16 18 Frequency (...
Description SP3T VPIN
SP3T PIN Switch

File Size 194.48K  /  3 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGP2103
OCR Text ...vember 16, 2005 TGP2103 Chip Assembly & Bonding Diagram GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. 8 TriQuint Semiconductor...
Description    8.5 - 11 GHz 6-Bit Phase Shifter

File Size 325.17K  /  9 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGP2100-EPU
OCR Text ...ust 9, 2004 TGP2100-EPU Chip Assembly & Bonding Diagram GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. Note: Devices designated as...
Description 30 GHz 5-Bit Phase Shifter

File Size 217.58K  /  9 Page

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    IRF3711 IRF3711L IRF3711S

IRF[International Rectifier]
Part No. IRF3711 IRF3711L IRF3711S
OCR Text ...ASSEMBLED ON WW 19, 1997 IN THE ASSEMBLY LINE "C" INTERNATIONAL RECTIFIER LOGO ASSEMBLY LOT CODE PART NUMBER DATE CODE YEAR 7 = 1997 WEEK 19 LINE C 8 www.irf.com IRF3711/3711S/3711L D2Pak Package Outline D2Pak Part Marking I...
Description Power MOSFET(Vdss=20V, Rds(on)max=6.0mohm, Id=110A??
Power MOSFET(Vdss=20V/ Rds(on)max=6.0mohm/ Id=110A)
Power MOSFET(Vdss=20V, Rds(on)max=6.0mohm, Id=110A?)
Power MOSFET(Vdss=20V, Rds(on)max=6.0mohm, Id=110A)
Power MOSFET(Vdss=20V, Rds(on)max=6.0mohm, Id=110A?

File Size 243.87K  /  11 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGL4203-EPU
OCR Text ...ld be observed during handling, assembly and test. Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change ...
Description 50 GHz Wideband Analog Attenuator

File Size 357.15K  /  10 Page

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    TriQuint Semiconductor, Inc.
TriQuint Semiconductor,Inc.
TRIQUINT[TriQuint Semiconductor]
Part No. TGL2201-EPU
OCR Text ...1-EPU High Isolation Limiter Assembly RF In RF Out DC Schematic Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specificatio...
Description Wideband Dual Stage VPIN Limiter 3000 MHz - 25000 MHz RF/MICROWAVE LIMITER

File Size 244.47K  /  5 Page

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    MAX811TEUS

Maxim Integrated Products
Part No. MAX811TEUS
OCR Text ...cation: D. Transistor Count: D. Assembly Location: E. Date of Initial Production: 4-Pin P Voltage Monitors with Manual Reset Input S12 (SG1.2) - Standard 1.2 micron silicon gate CMOS Oregon, USA 341 Malaysia or Thailand January, 1997 III...
Description PLASTIC ENCAPSULATED DEVICES

File Size 54.89K  /  8 Page

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    IDTech
Part No. ITQX20E
OCR Text ...or bending forces to the module assembly.care should be taken in the design of the monitor housing and the assembly procedure to prevent stress damage to the panel especially the lamp cable and the lamp connector.. ? use standard earthing/g...
Description 20.8 QXGA Color TFT/LCD Module

File Size 326.00K  /  42 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGF4350-EPU TGF4350
OCR Text ...mation TGF4350-EPU Process and Assembly Notes This device should be attached using conductive epoxy only. Contact factory for additional details as required. Component placement and adhesive attachment assembly notes: *= *= *= *= *= ...
Description 300um Discrete pHEMT

File Size 551.97K  /  5 Page

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