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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TGS2303-EEU
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OCR Text |
...Compatible with Fully Automated Assembly Series-Shunt-Shunt Configuration
Chip Dimensions 2.16 x 1.65 x 0.1 mm
* *
Typical Wafer Probe Data
0 -5 -10
Return Loss (dB)
-15 -20 -25 -30 -35 -40 2 4 6 8 10 12 14 16 18 Frequency (... |
Description |
SP3T VPIN SP3T PIN Switch
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File Size |
194.48K /
3 Page |
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TGP2103
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OCR Text |
...vember 16, 2005
TGP2103 Chip Assembly & Bonding Diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
8
TriQuint Semiconductor... |
Description |
8.5 - 11 GHz 6-Bit Phase Shifter
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File Size |
325.17K /
9 Page |
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TGP2100-EPU
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OCR Text |
...ust 9, 2004
TGP2100-EPU Chip Assembly & Bonding Diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
Note: Devices designated as... |
Description |
30 GHz 5-Bit Phase Shifter
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File Size |
217.58K /
9 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TGL4203-EPU
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OCR Text |
...ld be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change ... |
Description |
50 GHz Wideband Analog Attenuator
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File Size |
357.15K /
10 Page |
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it Online |
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TriQuint Semiconductor, Inc. TriQuint Semiconductor,Inc. TRIQUINT[TriQuint Semiconductor]
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Part No. |
TGL2201-EPU
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OCR Text |
...1-EPU
High Isolation Limiter Assembly
RF In
RF Out
DC Schematic
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specificatio... |
Description |
Wideband Dual Stage VPIN Limiter 3000 MHz - 25000 MHz RF/MICROWAVE LIMITER
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File Size |
244.47K /
5 Page |
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it Online |
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IDTech
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Part No. |
ITQX20E
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OCR Text |
...or bending forces to the module assembly.care should be taken in the design of the monitor housing and the assembly procedure to prevent stress damage to the panel especially the lamp cable and the lamp connector.. ? use standard earthing/g... |
Description |
20.8 QXGA Color TFT/LCD Module
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File Size |
326.00K /
42 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TGF4350-EPU TGF4350
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OCR Text |
...mation
TGF4350-EPU Process and Assembly Notes
This device should be attached using conductive epoxy only. Contact factory for additional details as required.
Component placement and adhesive attachment assembly notes: *= *= *= *= *= ... |
Description |
300um Discrete pHEMT
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File Size |
551.97K /
5 Page |
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it Online |
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Price and Availability
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