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  85003-1081 Datasheet PDF File

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    Kondenshi Corp
Part No. KOD-1081
Description Photo diode IC

File Size 286.95K  /  2 Page

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Amphenol Communications Solutions

Part No. 108-1311-100
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, Guide Module, With Post, No Key.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    160-1081 160-1081-02-05-00

WEARNES CAMBION LTD
CAMBION Electronic Components
Part No. 160-1081 160-1081-02-05-00
Description BRASS, PCB TERMINAL
Solder terminal, turreted, feed thru

File Size 25.08K  /  1 Page

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Amphenol Communications Solutions

Part No. 108-1511-200
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, Guide Module, No Key.
Tech specs    

Official Product Page

    KODENSHI[KODENSHI KOREA CORP.]
Part No. KOD-1081
Description Photo diode IC

File Size 275.45K  /  2 Page

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Amphenol Communications Solutions

Part No. 108-1811-201
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, Guide Module, Ground Contact, No Key.
Tech specs    

Official Product Page

    F1081

POLYFET[Polyfet RF Devices]
Part No. F1081
Description PATENTED GOLD METALIZED SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR

File Size 39.37K  /  2 Page

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Amphenol Communications Solutions

Part No. 108-1211-200
Description Paladin® 112Gb/s Backplane Connector, 2-Pair, Guide Module, No Key.
Tech specs    

Official Product Page

    EY3A-1081

Omron Electronics LLC
Part No. EY3A-1081
Description Single Beam Sensor (1 Beam: 80 mm)

File Size 84.65K  /  2 Page

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Amphenol Communications Solutions

Part No. 108-1511-101
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, Guide Module, With Post, Ground Contact, No Key.
Tech specs    

Official Product Page

    3022-08A 22-03-1081

Molex Electronics Ltd.
Part No. 3022-08A 22-03-1081
Description 2.50mm (.098) Pitch Header, Single Row, 7.50mm (.295) Mating Pin Length, 8 Circuits

File Size 168.34K  /  4 Page

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Amphenol Communications Solutions

Part No. 108-1711-200
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, Guide Module, No Key.
Tech specs    

Official Product Page

    API Technologies Corp
Part No. 9001-100-1081
Description LOW Pass EMI Filter

File Size 33.87K  /  1 Page

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Amphenol Communications Solutions

Part No. 108-1211-201
Description Paladin® 112Gb/s Backplane Connector, 2-Pair, Guide Module, Ground Contact, No Key.
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 85003-0309 85003-0191 85003-0256 85003-0282
Description CONN, DIN 41612 TYPE C, 64 PIN MALE 64 CONTACT(S), MALE, RIGHT ANGLE TWO PART EURO CONNECTOR, SOLDER
DINCONN. C MALE 96CKT 850030191 96 CONTACT(S), MALE, RIGHT ANGLE TWO PART EURO CONNECTOR, SOLDER
DINCONN. C MALE 32CKT 850030256 32 CONTACT(S), MALE, RIGHT ANGLE TWO PART EURO CONNECTOR, SOLDER
DINCONN. C MALE 64CKT 850030282 64 CONTACT(S), MALE, RIGHT ANGLE TWO PART EURO CONNECTOR, SOLDER

File Size 78.25K  /  1 Page

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Amphenol Communications Solutions

Part No. 108-1511-100
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, Guide Module, With Post, No Key.
Tech specs    

Official Product Page

    70287-1081

Molex Electronics Ltd.
Part No. 70287-1081
Description 2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 68 Circuits, 8.13mm

File Size 303.42K  /  5 Page

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    EE-SX1081

Omron Electronics LLC
Part No. EE-SX1081
Description Photomicrosensor (Transmissive)

File Size 648.24K  /  4 Page

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