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Amphenol Communications Solutions |
| Part No. |
68000-705HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 5 Positions, 2.54 mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-112HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-219HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-109HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-220HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-426HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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SIEMENS[Siemens Semiconductor Group]
SIEMENS AG
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| Part No. |
Q68000-A4444 CGY40
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| Description |
From old datasheet system
GaAs MMIC (Single-stage monolithic microwave IC MMICamplifier Application range: 100 MHz to 3 GHz)
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| File Size |
30.36K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68000-606H
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-116HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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Official Product Page
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SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
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| Part No. |
Q68000-A6887 CGY31
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| Description |
GaAs MMIC (Two-stage monolithic microwave IC MMIC amplifier All-gold metallization Chip fully passivated)
From old datasheet system
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| File Size |
137.77K /
9 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68000-117
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 17 Positions, 2.54 mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68000-226HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 68005A1-004 |
| Maker: NQ80225B |
| Pack: PLCC |
| Stock: 17145 |
| Unit price
for : |
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50: $9.23 |
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100: $8.77 |
| 1000:
$8.31 |
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Email: oulindz@gmail.com |
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