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PANDUIT CORP
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| Part No. |
F6S3-3M1
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| OCR Text |
... ...benefits pre-polished fiber stub eliminates polishing steps, speeding installation mechanical crimp consistently provides higher than industry standard cable cable retention retention; requires no adhesive, speeding installation proven... |
| Description |
INTERCONNECTION DEVICE
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| File Size |
267.28K /
2 Page |
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it Online |
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Panduit, Corp.
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| Part No. |
FSCMM50RD FSCMM50BL
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| OCR Text |
...and benefits pre-polished fiber stub eliminates polishing steps, speeding installation vfl verification during provides installer with a visual signal when optimal crimp process continuity is made and the crimp step can be performed mechani... |
| Description |
Fiber Optic Connector; Fiber Diameter:50/125 um; Body Material:Zirconia Ceramic RoHS Compliant: Yes 50/125 um, MULTI MODE, SIMPLEX SC CONNECTOR
Fiber Optic Connector; Fiber Diameter:62.5/125 um; Body Material:Zirconia Ceramic RoHS Compliant: Yes 50/125 um, MULTI MODE, SIMPLEX SC CONNECTOR
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| File Size |
357.08K /
2 Page |
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it Online |
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QUICKLOGIC CORP
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| Part No. |
QL6325-E-6PQ208M QL6325-E-6PQ208C
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| OCR Text |
...sid (sstl3) sstl3 input delay: stub series terminated logic for 3.3 v - 0.55 ns t sid (sstl2) sstl2 input delay: stub series terminated logic for 2.5 v - 0.61 ns
www.quicklogic.com ? 2002 quicklogic corporation ql6325-e ec... |
| Description |
FPGA, 1536 CLBS, 320640 GATES, PQFP208
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| File Size |
306.20K /
36 Page |
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it Online |
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wj
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| Part No. |
AH201
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| OCR Text |
...th = .028", spacing = .036" The stub on pin 4 is added for additional external matching.
Pin 4 is used as a location for internal matching with bond wires. This pin should not be grounded for proper operation. Gap is .010". Pad is .044" ... |
| Description |
IC,MICROWAVE/MILLIMETER WAVE AMPLIFIER,SINGLE,LLCC,10PIN,CERAMIC
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| File Size |
254.30K /
7 Page |
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it Online |
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BCD Semiconductor Manufacturing, Ltd.
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| Part No. |
M395T2953EZ4-CE620 M395T2953EZ4-CE650
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| OCR Text |
... with memory system hav ing the stub-bus architecture. fb-dimm solution is intended t o eliminate this stub-bus channel bottleneck by using point-to-point links that enable multiple memory modules to be connected se rially to a given chann... |
| Description |
128M X 72 DDR DRAM MODULE, DMA240 ROHS COMPLIANT, DIMM-240
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| File Size |
634.65K /
31 Page |
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it Online |
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BCD Semiconductor Manufacturing, Ltd.
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| Part No. |
M395T2953EZ4-CE61
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| OCR Text |
... with memory system hav ing the stub-bus architecture. fb-dimm solution is intended t o eliminate this stub-bus channel bottleneck by using point-to-point links that enable multiple memory modules to be connected se rially to a given chann... |
| Description |
128M X 72 DDR DRAM MODULE, DMA240 ROHS COMPLIANT, DIMM-240
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| File Size |
645.50K /
33 Page |
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it Online |
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BCD Semiconductor Manufacturing, Ltd.
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| Part No. |
M395T2953CZ4-CE601
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| OCR Text |
... with memory system hav ing the stub-bus architecture. fb-dimm solution is intended t o eliminate this stub-bus channel bottleneck by using point-to-point links that enable mult iple memory modules to be connected se rially to a given cha... |
| Description |
128M X 72 DDR DRAM MODULE, DMA240 ROHS COMPLIANT, DIMM-240
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| File Size |
530.77K /
32 Page |
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it Online |
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