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  ic-socket Datasheet PDF File

For ic-socket Found Datasheets File :: 2877    Search Time::3.016ms    
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    BPW484-1028-26AB95L CPW484-1028-26AB95L BUW484-1028-26AB95L

Actel Corporation
Part No. BPW484-1028-26AB95L CPW484-1028-26AB95L BUW484-1028-26AB95L
OCR Text ...quired by the BGA, or any other IC package the socket was designed for (except if locating pegs are used; see `Locating Pegs' section of this document). When compared to mounting a BGA, an extra volume of solder paste is required to mount t...
Description BGA484, IC SOCKET
SE-FGG484-H, E-Tec lead free prototype socket drawing for FGG484 and FGG484 packages

File Size 1,260.73K  /  8 Page

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    BPW144-1028-12AA95L BPW144-1228-12AA95 BPW144-1229-12AA95 BPW144-1230-12AA95 CPW144-1228-12AA95 BPW144-1270-12AA95

JST Mfg. Co., Ltd.
Actel Corporation
Part No. BPW144-1028-12AA95L BPW144-1228-12AA95 BPW144-1229-12AA95 BPW144-1230-12AA95 CPW144-1228-12AA95 BPW144-1270-12AA95
OCR Text ...quired by the BGA, or any other IC package the socket was designed for (except if locating pegs are used; see `Locating Pegs' section of this document). When compared to mounting a BGA, an extra volume of solder paste is required to mount t...
Description BGA144, IC SOCKET ROHS COMPLIANT
SE-FGG144-H, E-Tec lead free prototype socket drawing for FGG144 and FGG144 packages

File Size 1,148.91K  /  8 Page

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    20-353000-10 28-353000-10

Aries Electronics, Inc.
Part No. 20-353000-10 28-353000-10
OCR Text IC-to-DIP footprints * Ideal for prototyping and testing/evaluation * Available with PLCC sockets or PLCC pads on top side * Consult factory...SOCKET CONTACTS: Phosphor Bronze * SOCKET CONTACT PLATING: 200 [5.08] Sn/Pb 93/7 per ASTM B579-73 ov...
Description PLCC-to-DIP Adapter

File Size 512.11K  /  1 Page

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    BPW1152-1030-34AB95L CUW1152-1030-34AB95 LPW1152-1030-34AB95 BPW1152-0729-34AB95

Actel Corporation
Part No. BPW1152-1030-34AB95L CUW1152-1030-34AB95 LPW1152-1030-34AB95 BPW1152-0729-34AB95
OCR Text ...quired by the BGA, or any other IC package the socket was designed for (except if locating pegs are used; see `Locating Pegs' section of this document). When compared to mounting a BGA, an extra volume of solder paste is required to mount t...
Description FG1152, 35x35mm, 1.00mm pitch E-tec lead free Socket Drawing
BGA1152, IC SOCKET

File Size 1,281.33K  /  8 Page

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    Future Technology Devic...
Part No. UMFT240XA-01
OCR Text ....................... 16 7 ic package markings ................................ ................... 17 8 umft201xe module circuit schematic .......................... 18 9 internal mtp rom configuration .....................
Description UMFT201XE USB to I2C Development Module

File Size 714.82K  /  23 Page

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    BCM97110

Broadcom Corporation.
Part No. BCM97110
OCR Text ... integrated BCM7110 single-chip IC results in a cost* * * * * * * DOCSIS /EuroDOCSISTM/DAVIC and PVR * Dual 1024/256/64-QAM variable symb...Socket) 802.11 (PCMCIA Socket) Flash ROM Peripheral Connectors: USB UART Smart Cards The...
Description Single-Chip DOCSIS 1.1/PVR Set-Top Box Development Platform

File Size 177.85K  /  2 Page

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    BPW324-1028-18AB95L CCW324-1028-18AB95L BUW324-1028-18AB95L BPW324-1029-18AB95L BPW324-0529-18AB95 BPW324-0530-18AB95 BP

Actel Corporation
Part No. BPW324-1028-18AB95L CCW324-1028-18AB95L BUW324-1028-18AB95L BPW324-1029-18AB95L BPW324-0529-18AB95 BPW324-0530-18AB95 BPW324-0630-18AB95L BPW324-0530-18AB95L BPW324-0570-18AB95 BPW324-0570-18AB95L BPW324-0628-18AB95 BPW324-0628-18AB95L BPW324-0728-18AB95L
OCR Text ...quired by the BGA, or any other IC package the socket was designed for (except if locating pegs are used; see `Locating Pegs' section of this document). When compared to mounting a BGA, an extra volume of solder paste is required to mount t...
Description SE-FGG324-H, E-Tec lead free prototype socket drawing for FGG324 and FGG324 packages
BGA324, IC SOCKET

File Size 1,203.61K  /  8 Page

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    BPW180-0830-14CB95

Actel Corporation
Part No. BPW180-0830-14CB95
OCR Text ...quired by the BGA, or any other IC package the socket was designed for (except if locating pegs are used; see `Locating Pegs' section of this document). When compared to mounting a BGA, an extra volume of solder paste is required to mount t...
Description SE-CSG180, E-Tec lead free prototype socket drawing for CSG180 and CSG180 packages

File Size 1,139.50K  /  8 Page

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    EPCOS AG
Part No. XLT20SS XLT20S01
OCR Text ...me in many dif- ferent types of ic packages, i.e., dip, plcc, soic, ssop, mqfp, etc. typically, development cycle components are eprom based...socket is specifically designed to provide compatibility between two dif- fering types of ic package...
Description TRANSITION SOCKET
20PIN- 300MIL SO TRANS SKT 20针,300MIL苏反式SK电信

File Size 288.72K  /  36 Page

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    BPW180-0828-14CB95

Actel Corporation
Part No. BPW180-0828-14CB95
OCR Text ...quired by the BGA, or any other IC package the socket was designed for (except if locating pegs are used; see `Locating Pegs' section of this document). When compared to mounting a BGA, an extra volume of solder paste is required to mount t...
Description SE-CSG180-H, E-Tec lead free prototype socket drawing for CSG180 and CSG180 packages

File Size 1,152.91K  /  8 Page

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For ic-socket Found Datasheets File :: 2877    Search Time::3.016ms    
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