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Advanced Micro Devices, Inc.
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| Part No. |
AM29LV200BB-70DFC AM29LV200BB-70DWI AM29LV200BB-90DPI AM29LV200BB-90DTC AM29LV200BB-70DRI AM29LV200BB-90DFC AM29LV200BB-70DPC AM29LV200BB-70DPI AM29LV200BB-70DTC AM29LV200BB-70DWC AM29LV200BB-90DFI AM29LV200BB-90DRC AM29LV200BB-70DRC AM29LV200BB-90DPC AM29LV200BB-90DRI AM29LV200BB-90DWC AM29LV200BB-70DFI AM29LV200BB-90DTI AM29LV200BB-70DTI AM29LV200BB35DTI1 AM29LV200BT35DTI1 AM29LV200BB-120DRI AM29LV200BB-60RDRI AM29LV200BB-120DRC AM29LV200BB-60RDTC AM29LV200BT-120DRI AM29LV200BT-120DRC AM29LV200BB-60RDPI AM29LV200BB-60RDWC AM29LV200BB-60RDTI AM29LV200BB-120DTI AM29LV200BT-120DTI AM29LV200BB-60RDFI AM29LV200BT-120DWI AM29LV200BB-120DTC AM29LV200BB-120DWI AM29LV200BB-60RDWI AM29LV200BT-120DTC AM29LV200BB-60RDRC AM29LV200BB-60RDFC AM29LV200BT-70DWI AM29LV200BB-90DWI AM29LV200BT-60RDWI AM29LV200BB-60RDPC AM29LV200BB-70RDFE AM29LV200BT-60RDTC AM29LV200BT-60RDFC AM29LV200BT-60RDPC AM29LV200BT-60RDPI AM29LV200BT-60RDRC AM29LV200BT-60RDRI AM29LV200BT-60RDFI AM29LV200BB-120DFC AM29LV200BB-120DPC AM29LV200BB-120DFI AM29LV200BB-120DPI AM29LV200BB30DTI1 AM29LV200BB30DFI1 AM29LV200BB30DPI1 AM29LV200BB35DFI1 AM29LV200BB35DPI1 AM29LV200BB35DWI1 AM29LV200BB50DWI1 AM29LV200BB30DWI1 AM29LV200BB50DR
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| Description |
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 128K X 16 FLASH 3V PROM, 70 ns, UUC43
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 128K X 16 FLASH 3V PROM, 90 ns, UUC43
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 128K X 16 FLASH 3V PROM, 60 ns, UUC43
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 2兆位56亩x 8-Bit/128亩x 16位）.0伏的CMOS只，引导扇区快闪记忆体，修编模具1
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 2兆位56x 8-Bit/128x 16位）.0伏的CMOS只，引导扇区快闪记忆体，修编模具1
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 128K X 16 FLASH 3V PROM, 120 ns, UUC43
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 2兆位256亩x 8-Bit/128亩x 16位）.0伏的CMOS只，引导扇区快闪记忆体，修编模具1
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1 2兆位56亩x 8-Bit/128亩x 16位）3.0伏的CMOS只，引导扇区快闪记忆体，修编模具1
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| File Size |
189.60K /
11 Page |
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Amphenol, Corp.
Welwyn Components, Ltd.
AMPHENOL CORP
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| Part No. |
117DFEH09SAZ4-RM5 117DFBG25SAZ4-RM5 117DFCG37SAZ4-RM5 117DFAG15SAZ4-RM5 117DFAH15PAZ4-RM5 117DFBG25PAZ4-RM5 117DFBH25PAZ4-RM5 117DFCH37SAZ4-RM5 117DFDH50SAZ4-RM5 117DFDG50SAZ4-RM5 117DFDH50PAZ4-RM5 117DFCG37PAZ4-VFM 177DFCG37SAZ4RM5 117DFBH25PAZ4-VFM 117DFCG37SAZ4-VFM 117DFAG15PAZ4-VFM 117DFAG15SAZ4-VFM 117DFBG25SAZ4-VFM2 117DFAG15SAZ4-VFM2 177DFCG37PAZ4VF2 117DFAH15PAZ4-VFM 117DFAG15PAZ4-VFM2 117DFCG37SAZ4-VFM2 117DFAH15SAZ4-VFM 177DFCG37PAZ4VFM 177DFCG37SAZ4VF 177DFBH25P1AMNVFM 177DFCG37PAZ4RM5 177DFBH25P1AONVF 177DFBH25P1AONVFM 117DFBG25PAZ4-VFM 117DFCG37PAZ4-VF2 117DFCG37PAZ4-VFM2 177DFCG37SAZ4VF2 117DFAH15SAZ4-VFM2 117DFBG25PAZ4-VFM2 177DFBH25P1AMNVFM2 177DFBH25P1AONVFM2 177DFBH25P1APNVFM 177DFBH25P1APNVFM2 177DFBH25P1APNVF2 177DFBH25P1AONVF2 117DFCG37SAZ4-VF2 177DFBH25P1ATNVF 177DFCG37PAZ4VFM2 177DFBH25P1AMNVF2 117DF-C-37-P-OL2RM8 117DF-C-37-S-OL2RM8 117DF-C-37-P-OL2RM5 117DFCH37P1AON-RM5 117DFEG09P1BON-RM5 117DFDG50POL2-RM5 117DFEH09S1BON-RM5 117DFAG15P1BON-VFM 117DFAH15POL2-RM5 117DFAG15S1BON-RM5 117DFAG15P1AON-RM5 117DFEH09S1AON-RM5 117DFCH37P1BON-RM5 117DFCH37S1BON-RM5 117DFCG37S1BON-RM5 117DFEG09S1AON-RM5 117DFCG37P1BON-RM5 117DFCH37S1AON-RM5 117DFEG09S1BON-RM5 117DFEG09
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| Description |
9 CONTACT(S), FEMALE, D SUBMINIATURE CONNECTOR, SOLDER
37 CONTACT(S), FEMALE, D SUBMINIATURE CONNECTOR, SOLDER, RECEPTACLE
37 CONTACT(S), MALE, D SUBMINIATURE CONNECTOR, SOLDER, RECEPTACLE
25 CONTACT(S), MALE, D SUBMINIATURE CONNECTOR, SOLDER, RECEPTACLE
15 CONTACT(S), MALE, D SUBMINIATURE CONNECTOR, SOLDER, RECEPTACLE
50 CONTACT(S), MALE, D SUBMINIATURE CONNECTOR, SOLDER, RECEPTACLE
9 CONTACT(S), MALE, D SUBMINIATURE CONNECTOR, SOLDER, RECEPTACLE
15 CONTACT(S), FEMALE, D SUBMINIATURE CONNECTOR, SOLDER, RECEPTACLE
25 CONTACT(S), FEMALE, D SUBMINIATURE CONNECTOR, SOLDER, RECEPTACLE
50 CONTACT(S), FEMALE, D SUBMINIATURE CONNECTOR, SOLDER, RECEPTACLE
25 CONTACT(S), MALE, D SUBMINIATURE CONNECTOR, SOLDER, PLUG
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| File Size |
990.02K /
6 Page |
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it Online |
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Vishay Intertechnology,Inc.
Vishay Intertechnology, Inc.
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| Part No. |
PL342 PL34120191000GDDC PL34120191000KKEX PL34120191000KXDD PL34120191000KXDF PL34120191000GDBX PL34120191000GDDD PL34120191000CFDG PL34120191000MDEG PL34120191000MDBG PL34120191000MHDG PL34120191000MFDG PL34120191000MJDG PL34120191000CFBG PL34120191000CFEG PL34120191000DFDG PL34120191000DFEG PL34120191000MFEG PL34120191000MJBG PL34120191000MHEG PL34120191000MHBG PL34120191000MDDG PL34120191000MFBG PL34120191000GFBC PL34220191000CFBG PL34120191000DHDX PL34120191000DHEX PL34220191000DHBX PL34220191000DHDX PL34220191000DHEX PL34120191000DHBX PL34120191000DHBD PL34120191000DHBC PL34220191000DKBC PL34220191000DJBC PL34220191000BJBC PL34120191000DJBG PL34220191000CXBG PL34220191000FHBG PL34220191000DXBC PL34220191000BHBC PL34120191000DKBG PL34220191000CFBC PL34120191000DXBG PL34220191000CJBC PL34120191000CJBG PL34120191000FHBG PL34220191000CJBG PL34220191000BKBG PL34220191000DHBG PL34120191000CXBG PL34120191000DHBG PL34220191000BHBG PL34220191000BXBG PL34220191000DJBG PL34220191000DXBG PL34220191000FJBG PL34220191000BJBG PL34220191000CDBC PL34220191000CXBC PL34220191000DHBC PL34220191000DKBG PL34120191000MDBD PL34120191000MDBC PL34120191000MDBF PL34120191000MDBX PL34120191000DHEF PL3412
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| Description |
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±14; Dark
Infrared Light Emitting Diodes Top View Type; Type: Surface Mount Type (Sideview); Peak light emitting wavelength P (nm): 950; Half viewing angle
Infrared Light Emitting Diodes Top View Type; Type: Sideview Resin; Peak light emitting wavelength P (nm): 950; Half viewing angle 1/2 (deg): ±
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±32; Dark
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 3.0x2.5(t=2.5); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 1;
Schottky Barrier Diodes; Package: TO220FN; Constitution materials list: Packing style: Bulk; Package quantity: 500;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 81.3; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 2.6x1.6(t=0.8); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 0.7;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 1.9x1.3(t=0.6); Number of terminal: 2; Reverse voltage VR(V): 100; Average rectified forward current IO(A): 0.5;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
High Sensitivity Chip Sensors Sideview Type; Type: Surface Mount Type; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±12; Dark current ICEO (Max.)(µA): 0.5; Response time tr·tf (µA): 10; Yes;
Reflective Type Photosensors (Photoreflectors); Type: Cased Type; Light Emitting Diode: 630; Phototransistor: 600; Collector current IC (Min.)(mA): 0.08; Response time tr·tf (µs): 10;
Photointerrupter General Type; Packing style: Plastic bag; Package quantity: 400; 塑料无引线芯片载
Plastic Leadless Chip Carrier 塑料无引线芯片载
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 80; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24; 塑料无引线芯片载
Lead Frame Remote Control Receiver Modules (5V Type); Packing style: Stick; Package quantity: 1000; 塑料无引线芯片载
660/780nm Dual Wave Low Power Lasers; Packing style: Tray; Package quantity: 500; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 400; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 5.5x6.5(t=2.3); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 6;
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| File Size |
127.83K /
2 Page |
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it Online |
Download Datasheet |
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