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Motorola
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Part No. |
MPXV6115VC6U
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OCR Text |
...pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerance... |
Description |
High Temperature Accuracy Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated From old datasheet system
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File Size |
90.65K /
8 Page |
View
it Online |
Download Datasheet
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Price and Availability
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