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wedge Datasheet PDF File

For wedge Found Datasheets File :: 1098 Search Time::1.61ms
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				Filtronic Compound Semiconductors
Part No.	FMS2021
OCR Text	...e raised above 60g. Thermosonic wedge bonding and thermocompression wedge bonding can also be used to achieve good wire bonds. Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the...
Description	DC- 6 GHZ SPDT WLAN GAAS LOW LOSS SWITCH
File Size	118.42K / 4 Page	View it Online	Download Datasheet

				Filtronic Compound Semiconductors
Part No.	FMS2022
OCR Text	...e raised above 60g. Thermosonic wedge bonding and thermocompression wedge bonding can also be used to achieve good wire bonds. Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the...
Description	DC-4 GHZ MMIC SP4T ABSORPTIVE SWITCH
File Size	147.00K / 4 Page	View it Online	Download Datasheet

				Filtronic Compound Semiconductors
Part No.	FMS2023 FMS2023-000
OCR Text	...e raised above 60g. Thermosonic wedge bonding and thermocompression wedge bonding can also be used to achieve good wire bonds. Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the...
Description	DC-20 GHZ MMIC LOW LOSS SPST ABSORPTIVE SWITCH
File Size	103.80K / 4 Page	View it Online	Download Datasheet

				Filtronic Compound Semiconductors
Part No.	FMS2024 FMS2024-000
OCR Text	...e raised above 60g. Thermosonic wedge bonding and thermocompression wedge bonding can also be used to achieve good wire bonds. Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the...
Description	DC-20 GHZ MMIC SPDT REFLECTIVE SWITCH
File Size	104.27K / 4 Page	View it Online	Download Datasheet

				Filtronic Compound Semiconductors
Part No.	FMS2027 FMS2027-000
OCR Text	...e raised above 60g. Thermosonic wedge bonding and thermocompression wedge bonding can also be used to achieve good wire bonds. Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the...
Description	DC20 GHZ MMIC SPDT NON-REFLECTIVE SWITCH DC-20 GHZ MMIC SPDT NON-REFLECTIVE SWITCH
File Size	101.23K / 4 Page	View it Online	Download Datasheet

				FILTRONIC[Filtronic Compound Semiconductors]
Part No.	FMS2029-000 FMS2029
OCR Text	...e raised above 60g. Thermosonic wedge bonding and thermocompression wedge bonding can also be used to achieve good wire bonds. Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the...
Description	DC?20 GHZ MMIC SPST NON-REFLECTIVE SWITCH DC-20 GHZ MMIC SPST NON-REFLECTIVE SWITCH DC20 GHZ MMIC SPST NON-REFLECTIVE SWITCH
File Size	97.04K / 4 Page	View it Online	Download Datasheet

				Micross Components
Part No.	HMC341
OCR Text	... schedule. wire bonding ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 gram...
Description	Millimeterwave Point-to-Point Radios
File Size	879.90K / 9 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC140
OCR Text	...Mixers Wire Bonding Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recom...
Description	GAAS MMIC DOUBLE-BALANCED MIXER 1.0 - 2.0 GHZ
File Size	73.35K / 4 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC383
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 gr...
Description	GAAS PHEMT MMIC MEDIUM POWER AMPLIFIER, 12 - 30 GHZ
File Size	329.93K / 8 Page	View it Online	Download Datasheet

				Micross Components
Part No.	HMC486
OCR Text	... schedule. wire bonding ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams...
Description	Point-to-Multi-Point Radios
File Size	917.04K / 11 Page	View it Online	Download Datasheet

For wedge Found Datasheets File :: 1098 Search Time::1.61ms
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