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Motorola
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| Part No. |
MPXV4006G
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| OCR Text |
...er (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV4006G series sensor operating characteristics are based... |
| Description |
MPXV4006G Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
From old datasheet system
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned,Temperature Compensated and Calibrated
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| File Size |
175.66K /
12 Page |
 View
it Online |
Download Datasheet
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Motorola
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| Part No. |
MPXV5050G MPX5050
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| OCR Text |
...er (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX5050/MPXV5050G series pressure sensor operating character... |
| Description |
MPX5050 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
From old datasheet system
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned,Temperature Compensated and Calibrated
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| File Size |
155.55K /
12 Page |
View
it Online |
Download Datasheet |
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Motorola
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| Part No. |
MPX2201 MPX2200AP
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| OCR Text |
...essure Differential
SILICONE gel DIE COAT WIRE BOND
WIRE BOND
LEAD FRAME
DIFFERENTIAL/GAUGE ELEMENT P2
DIE BOND
LEAD FRAME
Figure 4. Cross-Sectional Diagrams (Not to Scale)
Figure 4 illustrates an absolute sensing di... |
| Description |
200 kPa on-Chip Temperature Compensated & Calibrated Pressure Sensors
From old datasheet system
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| File Size |
158.03K /
8 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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