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For backside Found Datasheets File :: 7434 Search Time::7.031ms
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				Mimix Broadband
Part No.	XP1006-BD-EV1 XP1006-BD-000V XP1006-BD
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for radar applications. Absolute Maximum Ratings Supply Volta...
Description	8.5-11.0 GHz GaAs MMIC Power Amplifier
File Size	222.17K / 8 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	XP1011-BD-EV1 XP1011-BD-000V XP1011-BD-000W XP1011-BD
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT a...
Description	36.0-40.0 GHz GaAs MMIC Power Amplifier
File Size	152.78K / 6 Page	View it Online	Download Datasheet

				MIMIX BROADBAND INC
Part No.	XP1013-BD-EV1 XP1013-BD-000V XP1013-BD
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT a...
Description	17000 MHz - 26000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER 17.0-26.0 GHz GaAs MMIC Power Amplifier
File Size	462.45K / 7 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	XP1014-BD-EV1 XP1014-BD-000V XP1014-BD
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for radar applications. Absolute Maximum Ratings Supply Volta...
Description	8.5-11.0 GHz GaAs MMIC Power Amplifier
File Size	132.54K / 5 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	XP1015-BD-EV1 XP1015-BD-000V XP1015-BD
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT a...
Description	43.5-46.5 GHz GaAs MMIC Power Amplifier
File Size	224.38K / 5 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	XP1016-BD-EV1 XP1016-BD-000V XP1016-BD
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT a...
Description	43.5-46.5 GHz GaAs MMIC Power Amplifier
File Size	293.93K / 5 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	XP1017-BD-EV1 XP1017-BD-000V XP1017-BD
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT a...
Description	30.0-36.0 GHz GaAs MMIC Power Amplifier
File Size	590.37K / 6 Page	View it Online	Download Datasheet

				TI store
Part No.	DRV8811
OCR Text	...layer, 1.6 mm thick pcb with no backside copper. (2) the jedec low-k board used to derive this data was a 76 mm x 114 mm, 2-layer, 1.6 mm thick pcb with 25 cm 2 2-oz copper on backside. (3) the jedec high-k board used to derive this data wa...
Description	<font color=red>[Old version datasheet]</font> STEPPER MOTOR CONTROLLER IC
File Size	844.54K / 19 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	XP1018-BD-EV1 XP1018-BD-000X XP1018-BD
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT a...
Description	37.0-42.0 GHz GaAs MMIC Power Amplifier
File Size	354.96K / 8 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	XP1026-BD07 XP1026-BD XP1026-BD-000V
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT a...
Description	27.0-32.0 GHz GaAs MMIC Power Amplifier
File Size	259.68K / 5 Page	View it Online	Download Datasheet

For backside Found Datasheets File :: 7434 Search Time::7.031ms
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